CAMtek, Inc.

	Applications

	PRINTED CIRCUIT BOARD ASSEMBLY Multi-layer PCBs (10 layers) with top and bottom side surface mount components, as well as, top-side through-hole leaded components. Component types include: 484-pin BGA, Mini BGA, Fine Pitch Quad Flat Packs, Hybrid Circuits, PLCC, SOIC, DPAK, SOT, 1206, 0805 and 0402 chip resistors and capacitors. Click image to enlarge.

	OTHER ELECTRONIC ASSEMBLIES Electronic assemblies including: back planes, circuit boards, cables, mechanical assemblies and box builds with and without potting - complete with functional testing. Click image to enlarge.

	VOLUME ASSEMBLY With two (2) surface mount lines, CAMtek has the capability to support projects from prototype to production. Average annual production volumes range from 100 to 50,000 units per year depending on the complexity of the printed circuit board. Click image to enlarge.

	BOX BUILD ASSEMBLY Final assemblies include box build projects such as these shown above. Most of these include printed circuit card assembly, testing, cable assembly, mechanical assembly, and final test. Click image to enlarge.

	AUTOMATED OPTICAL INSPECTION (AOI) CAMtek utilizes an Automated Optical Inspection (AOI) machine for all of our printed circuit board assemblies less than 18 inches in length. This process can identify missing components, polarity, manufacturer’s part numbers, size, shape, color, and solder bridging. Click image to enlarge.

	TEST AND TROUBLESHOOTING CAMtek utilizes customer supplied test fixtures for many of the items we assemble. We will build to print per customer specifications and/or develop fixtures to support our customer’s product. Our electrical engineers (EE) have the capability of troubleshooting PCB assemblies to component level as well as performing board level repair Click image to enlarge.